Asks for

The ad says“Problem-Solving Skills: Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D, statistic, etc…)”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks.”
The ad says“NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“Education & Experience: Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related disciplines, with 3+ years of experience in semiconductor packaging engineering.”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”
The ad says“OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control.”
The ad says“Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).”

Company Description

Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to improve quality of life all across the globe. Welcome to Bosch.

博世集團於1990 年開始在台灣營運，2006年10月整合台灣地區各事業單位，成立在台事業總部，命名為台灣羅伯特博世股份有限公司。自此即開始為在地客戶提供提升其生活品質的產品與服務。由於我們持續不斷的投資及發展，目前博世在台有三個分公司以及四個研發中心。博世在台提供的產品包含汽車原廠零件、汽車零件售後服務、電動自行車系統、傳動與控制系統、安防通訊系統、熱能產品、電動工具、家電產品以及微機電感測器等。在台灣，博世同時也致力於履行企業社會責任，長期投入在道路安全、環境保護及社會關懷之重點領域。在2013年，台灣博世展開長期的「博世成就愛」社會公益計畫，並舉辦了數場提倡摩托車道路安全的校園宣導活動，同時也與台灣社會大眾分享了博世低碳最佳範例為環保盡一份心力。台灣博世身為全球科技與服務之領導廠商博世集團旗下的一員。博世集團的策略性目標是藉由創新實現互聯生活，在全球透過創新及激發熱情的產品與服務，提升人們的生活品質。簡言之，博世期許能「以科技成就生活之美」。

Job Description

We are seeking a motivated, skilled, and curious Semiconductor Packaging Engineer to support the development of innovative, automotive-grade ASIC products. This role serves as a key bridge between internal cross-functional partners and external assembly/test suppliers (OSATs). The ideal candidate combines technical packaging expertise with strong supplier management skills, a collaborative mindset, and a passion for continuous learning.

In this role, you will define, develop, and qualify robust packaging solutions. Your core tasks include:

Package Design & Process Development: Drive design, material selection, and optimize assembly processes in close collaboration with external suppliers and internal cross-functional teams.
Design & Risk Assessment: Participate in design risk reviews and Failure Mode and Effects Analyses (FMEAs) to mitigate assembly risks.
OSAT & Supplier Management: Manage OSAT partners to overview manufacturing and processes, track project timelines, and ensure effective quality control.
NPI & Process Qualification: Monitor prototyping runs and formal qualifications. Ensuring adherence to automotive standards (e.g., AEC-Q100, Q006).
Global Collaboration: Act as the technical interface to align packaging and assembly requirements with international design, test, and quality management teams.

Qualifications

Technical Experience & Capabilities

Education & Experience: Master’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, or related disciplines, with 3+ years of experience in semiconductor packaging engineering.

Solid Assembly Knowledge: Familiarity with legacy wire-bond technologies as well as flip-chip and advanced packaging solutions (e.g. QFN, QFP, SOIC, Flip-chip, BGA, SiP).

Problem-Solving Skills: Strong analytical skills to work systematically to solve complex technical challenges. (e.g. 8D, statistic, etc…)

Supplier Management: Proven ability to steer collaboration with external suppliers

Language & Travel Requirements

Language Skills: Excellent English (verbal and written, min. C1 level) for international collaboration, paired with professional Mandarin Chinese for technical discussions with local teams and regional suppliers.

Travel: Flexibility to travel to overseas supplier sites and OSAT manufacturing facilities according to project needs.