Asks for

The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Candidates should have prior hands-on IC design experience and must have participated in at least one successful silicon tapeout before moving into or expanding into a program management role. This technical background enables effective communication with engineering teams, informed decision-making, and proactive management of technical and schedule risks throughout the product development lifecycle.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Strong technical problem-solving skills, including risk assessment, root cause analysis, and decision support in a fast-paced engineering environment.”
The ad says“Strong technical problem-solving skills, including risk assessment, root cause analysis, and decision support in a fast-paced engineering environment.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Candidates should have prior hands-on IC design experience and must have participated in at least one successful silicon tapeout before moving into or expanding into a program management role. This technical background enables effective communication with engineering teams, informed decision-making, and proactive management of technical and schedule risks throughout the product development lifecycle.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”
The ad says“Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.”

Omni Design Technologies is seeking an experienced Technical Program Manager to lead the planning and execution of complex semiconductor IP and SoC development programs. The ideal candidate combines strong technical expertise with exceptional program management skills and has a solid foundation in semiconductor design.

Candidates should have prior hands-on IC design experience and must have participated in at least one successful silicon tapeout before moving into or expanding into a program management role. This technical background enables effective communication with engineering teams, informed decision-making, and proactive management of technical and schedule risks throughout the product development lifecycle.

In this role, you will work closely with Analog, Digital, Layout, and other cross-functional technical teams, as well as executive leadership, to ensure successful execution of multiple development programs from concept through silicon release.

Responsibilities and Qualifications

Lead cross-functional semiconductor development programs from architecture and planning through silicon release.

Schedule, coordinate, and track resources, milestones, dependencies, and risks to ensure timely execution of projects.

Coordinate execution and design reviews across Analog Design, Digital Design, Verification, Layout, Physical Design, CAD, Validation, and Applications teams.

Drive regular program reviews with engineering leadership and executive management, including clear status and decision tracking.

Identify technical and schedule risks early and work with stakeholders to define practical mitigation plans.

Partner with engineering managers to balance priorities, staffing requirements, and program deliverables.

Develop and maintain productive working relationships with partners, engineering teams, and leadership stakeholders distributed across global sites and time zones.

Interface with customers, vendors, and internal stakeholders for specific programs and project commitments as needed.

Improve project execution processes, planning methods, communication practices, and program tracking metrics.

Support adoption and disciplined use of project management tools such as Jira, Structure, Microsoft Project, Smartsheet, or similar systems.

BS/MS in Electrical Engineering, Computer Engineering, or a related technical discipline.

8+ years of semiconductor industry experience.

Minimum 2 years of hands-on IC design experience (Analog, Mixed-Signal, Digital, Verification, Physical Design, Layout, or Systems Engineering), including at least one complete ASIC, SoC, or IP development cycle through silicon tapeout in a technical engineering role.

3+ years of Technical Program Management, Engineering Program Management, or closely related project leadership experience for semiconductor development programs.

Strong understanding of the full semiconductor development lifecycle — from specification and architecture through RTL, synthesis, design, verification, physical implementation, timing closure, layout integration, tapeout, silicon validation, and production release.

Strong technical problem-solving skills, including risk assessment, root cause analysis, and decision support in a fast-paced engineering environment.

Excellent communication, organization, stakeholder management, influencing, and negotiation skills.

Experience managing Analog/Mixed-Signal IP, high-speed data converter, or SoC development programs

Asks for

Values

Responsibilities and Qualifications