Asks for

The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”
The ad says“Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.”

Job Description

Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI.
Define package technologies tooling & qualification for Commercial Industrial power device packaging for servers and AI power applications.
Benchmark, select and qualify suitable materials, processes and assembly subcontractors (OSAT Outsourced Semiconductor Assembly & Test).
Work with Renesas product designers to develop detailed Power Module package drawings for plastic packages using AutoCAD.
Work with OSAT (Outsourced Semiconductor Assembly & Test) to run DOE to optimize processes and establish process spec.
Work with Product groups and Reliability team, qualify new packages and processes within required schedule from Product Engineer/Program manager.
Develop and maintain technical expertise on advances and innovations Power Module plastic packages.
Participate in packaging roadmap development & focus on execution.

Qualifications

Doctorate/Masters / bachelor’s degree in Physics, Chemistry, Mechanical, Electrical or Materials Engineering.
5-12 years of relevant experience in package development emphasizing Power Module plastic package
Understanding of semiconductor Power Module plastic IC assembly processes, materials and technology. Knowledge of AutoCAD, Excel, PowerPoint, Word. Knowledge of wire-bonding, flip chip, SMT SPC(Statistical Process Control) and statistical analysis.
Strong interpersonal and communication skills.
Strong analytical and presentation skills.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.