About Lyte
Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai
If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!
About the role
- We are seeking Senior Level PCB Signal/Power Integrity Engineer to own and execute high-speed Signal Integrity (SI) and Power Distribution Network (PDN) simulations and validation.
What you'll do
- Collaborate with multi-disciplinary engineers (EE, System and Package) to define electrical performance related to SI, PI, EMI and EMC
- Develop engineering test plans and methodologies for SI and PI simulation, including modelling of power networks, parasitic, impedance-controlled transmission lines, vias, connectors, sockets, and system components.
- Validate power and signal integrity in laboratory settings, ensuring alignment with design specifications and simulation outcomes.
- Analyze simulation and lab data to identify design issues and propose corrective actions.
- Ability to support multiple projects concurrently, ensuring timely completion of design and validation tasks.
Required Qualifications
- Bachelor's degree in Electrical Engineering, or related field with at least 8 years of experience
- Proficiency with Ansys SIwave, Ansys HFSS, Altium 365, Cadence Sigrity, and Keysight ADS
- Experience design in of complex SoCs, PMICs, mixed-signal analog/digital designs for sensors and high-speed interfaces such as LPDDR4/4x, MIPI, 10G Ethernet and PCIe Gen 2/3
- Experience with system-level timing, loss budget including silicon, package and board impairments
- Experience with lab measurements, debugging, and SI correlations using oscilloscopes, spectrum analyzer, VNA and TDR
- Fluent in English communication, able to collaborate with teammates in different time zones
- Ability to travel internationally as needed
- Maintain company confidential information are a must
Preferred Qualifications
- Master’s degree with more experience is highly desired
- Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues
- Nice to have experience in substrate design and packaging technology
- Familiar with some of the device packaging processes such as die attach, flip chip, and wire bonding.
- Data analysis experience such as JMPs is a plus; Excel is OK.
- Programming and software maintenance skills are desired e.g. python, or C++
Benefits (subject to location and local regulations)
- Competitive salary and equity
- Comprehensive medical, dental, and vision coverage
- 401(k) retirement plan
- Flexible vacation and time-off policy
- Collaborative, fast-paced, and inclusive work environment
- Opportunity to work on cutting-edge technologies with a highly cross-functional team