Asks for

The ad says“Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.”
The ad says“Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.”
The ad says“Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.”
The ad says“Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.”
The ad says“Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.”
The ad says“Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.”
The ad says“Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.”
The ad says“Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.”
The ad says“Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.”
The ad says“Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools. Knowledge of wire-bonding, multi-chip modules, SiC/GaN packaging, and advanced substrates is preferred.”
The ad says“Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.”
The ad says“Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools. Knowledge of wire-bonding, multi-chip modules, SiC/GaN packaging, and advanced substrates is preferred.”
The ad says“Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools. Knowledge of wire-bonding, multi-chip modules, SiC/GaN packaging, and advanced substrates is preferred.”
The ad says“Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.”

Job Description

Responsibilities:

Lead package technology development and NPI execution, including R&D activities, coordination with global OSAT partners for new package development and product qualification, technology roadmap implementation, project budget tracking, and customer adoption programs.
Manage the design and development of package and interconnect solutions for Renesas AI and data center infrastructure power products, including Smart Power Stages, Vertical Power Stages, Power Modules, and discrete FET packages.
Support wide-bandgap SiC and GaN package development, DBC and AMB substrates, advanced interconnect technologies, wafer-level packaging, flip-chip, multi-chip modules, and power devices.
Evaluate, select, and qualify materials, processes, assembly subcontractors (OSATs), and contract manufacturers in alignment with product requirements, quality standards, cost targets, and capacity needs.
Partner with OSATs and contract manufacturers to plan and execute DOEs, optimize assembly processes, establish process specifications, and close technical gaps.
Coordinate with Product Groups, Design, Applications, Quality, Operations, and Reliability teams to qualify new packages and processes within committed schedules.
Drive resolution of package and process integration issues, ensuring robust process-window validation and risk assessment for critical manufacturing steps.
Define and implement production controls, monitors, and corrective actions to prevent quality incidents and improve manufacturing robustness.
Ensure smooth technology transfer into production and manage ramp-up monitoring, issue escalation, yield improvement, and readiness reviews.
Work closely with OSATs and contract manufacturers to identify and resolve early-production process issues and ensure products meet quality, reliability, delivery, and customer requirements.
Maintain strong technical expertise in power SiP/modules, wafer-level packaging, flip-chip interconnects, advanced substrates, and emerging power-package technologies, and translate industry developments into executable programs.
Contribute to packaging roadmap development and lead execution of assigned technology and product-development programs, including schedules, resources, risks, and cross-functional deliverables.
Lead technical response and corrective-action activities for internal and external customer concerns, partnering with Marketing, Product Groups, Quality, Operations, and Supply Chain teams.
Establish, document, and maintain package design rules and engineering standards.

Qualifications

Master’s or Bachelor’s Degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related discipline; doctorate is a plus.
12 to 15 years of relevant semiconductor package development experience, including technical or project leadership responsibility, with emphasis on power SiP/modules, wafer-level packaging, and flip-chip packaging.
Strong understanding of power SiP/modules, wafer-level and flip-chip packaging methods, assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools. Knowledge of wire-bonding, multi-chip modules, SiC/GaN packaging, and advanced substrates is preferred.
Demonstrated ability to lead cross-functional technical teams, manage multiple development programs, influence global manufacturing partners, and escalate risks with clear recovery plans.
Strong interpersonal, written, and verbal communication skills.
Strong analytical, problem-solving, project management, and presentation skills.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Asks for

Values

Job Description

Qualifications

Additional Information