Asks for

The ad says“Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings”
The ad says“Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects”
The ad says“Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)”
The ad says“Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)”
The ad says“Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization”
The ad says“Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects”
The ad says“Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects”
The ad says“Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization”
The ad says“Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings”
The ad says“Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)”
The ad says“Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects”
The ad says“Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects”
The ad says“Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization”
The ad says“Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)”
The ad says“Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization”

Step into a career with ASM, where cutting edge technology meets collaborative culture.

For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more than 4,500 ASMers representing 70 nationalities, our people and our advanced semiconductor devices are playing a crucial role in trends such as 5G, cloud computing, AI, and autonomous driving.  But we’re more than just a tech company. We value diversity, inclusion and sustainability as we strive to make a positive impact on the world. Our development programs help support your growth, shaping your future and pushing the boundaries of innovation to unleash potential.

Senior Engineer, Field Process (Boise, ID)

As a Senior Field Process Engineer, you will help expand ASM’s advanced film technologies at a customer site in Boise, Idaho by developing, optimizing, and transferring innovative ALD, PEALD, PECVD, and Epitaxy processes. You will serve as the technical interface between customer engineering teams and ASM’s global Business Unit, ensuring smooth and successful introduction of new products and processes. This role directly supports ASM’s mission to accelerate next‑generation semiconductor manufacturing through collaboration, technical excellence, and strong customer partnerships.

What you will be working on

Support New Product Introduction (NPI) by training with the Business Unit to gain deep expertise in new deposition processes and hardware
Lead the introduction, qualification, and transfer of new processes to the customer site
Partner closely with field hardware engineers and Business Unit teams to troubleshoot new products and develop process or hardware improvement proposals
Design and execute on-site experiments with customers to support development, integration, and continuous improvement projects
Escalate technical issues in a timely manner to maintain scope, timelines, and customer alignment
Document key learnings during NPI and ensure effective knowledge transfer to local service and manufacturing teams
Analyze baseline system and process performance against technology‑node requirements to identify gaps
Perform structured problem solving and root‑cause analysis on process or system nonconformances
Collaborate with customer teams to identify and grow opportunities for ASM hardware and process adoption
Support process transfer to high‑volume manufacturing (HVM) fabs, creating and maintaining best‑known methods (BKMs) and documentation
Maintain strong discipline around IP boundaries, customer communication, and escalation leadership

What we are looking for

PhD with relevant academic, research, or internship experience in materials science, chemical engineering, or physics or MS degree with relevant industry experience
Hands-on experience processing, developing, or characterizing thin films using thermal ALD, plasma ALD, plasma CVD, or epitaxy reactors through internships, research, or academic projects
Demonstrated troubleshooting and structured problem‑analysis skills (e.g., KT, FMEA, Ishikawa, 7‑step methodologies)
Experience designing, running, and interpreting DOEs or statistical experiments in academic, research, or internship settings
Familiarity with semiconductor device applications, vacuum techniques, metrology, and thin‑film characterization
Willingness and ability to travel for training and customer engagement; flexibility to support extended hours or weekends during qualifications or escalations
Strong written and verbal communication skills with the ability to clearly explain technical concepts
Ability to maintain confidentiality and uphold IP boundaries

What sets you apart

Industry, internship, research, or academic experience with ASM ALD, PEALD, PECVD, or Epitaxy equipment
Demonstrated success optimizing deposition processes in research, pilot, or HVM‑adjacent environments
Exposure to customer‑facing technical discussions, presentations, or reviews
Experience supporting process transfer, scale‑up, or qualification activities
Proven ability to collaborate cross‑functionally and contribute to structured action plans during technical challenges or escalations

Apply today to be part of what’s next.

We make the tech that enables the chips in devices which improve lives around the world. We do this with an eye to the future, pushing the boundaries of what’s possible through cutting-edge innovation, and driving the next wave of technological breakthroughs that shape how we live, work, and connect.

To learn more about ASM, find us at asm.com and on LinkedIn, Facebook, Instagram, X and YouTube.

ASM is an equal opportunity employer and considers qualified applicants for employment without regard to race, color, religion, age, nationality, social or ethnic origin, sexual orientation, gender, gender identify or expression, marital status, pregnancy, political affiliation, disability, genetic information, veteran status, or any other characteristic protected by law.

Asks for

Values