Asks for

The ad says“Experience in Solidworks/ Ansys, CAD and simulation tools”
The ad says“Experience in Solidworks/ Ansys, CAD and simulation tools”
The ad says“Conduct Design of Experiments (DOE) and optimize newly developed processes.”
The ad says“Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.”
The ad says“Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.”
The ad says“Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.”
The ad says“Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.”
The ad says“Strong background in Mechanical Engineering and semiconductor packaging process development.”
The ad says“Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.”
The ad says“Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.”
The ad says“Strong background in Mechanical Engineering and semiconductor packaging process development.”
The ad says“Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.”
The ad says“Experience in Solidworks/ Ansys, CAD and simulation tools”
The ad says“Experience in Solidworks/ Ansys, CAD and simulation tools”
The ad says“Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.”
The ad says“Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.”

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Job Description:

Responsible for the design and implementation of packaging processes for new isolation products.
Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.
Conduct Design of Experiments (DOE) and optimize newly developed processes.
Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.
Perform process yield analysis and failure investigations for new device-related issues.
Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.
Strong background in Mechanical Engineering and semiconductor packaging process development.
Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.
Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.
Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.
Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.
Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.
Experience in Solidworks/ Ansys, CAD and simulation tools

Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.

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