Filtronic PLC is a world leader in the design and manufacture of customised microwave and millimetre wave electronics. Our products are used within satellite, defence, terrestrial telecommunications and other related applications. Our investment in high calibre staff, leading edge technology and a world class manufacturing facility underpin our growth strategy and our aim to be a world class supplier of high frequency products and solutions.
As we scale our advanced packaging and assembly capability at NetPark, we are expanding our Process Engineering team to support the transition of new technologies from development into stable, high-yield production.
The Process Engineer is responsible for the evaluation, development, optimisation and control of advanced semiconductor and RF module assembly processes. The role focuses particularly on die attach technologies (silver epoxy, silver sinter, and eutectic attach) and gold wire/ribbon bonding across a range of substrate and device materials.
In addition, the Process Engineer will work closely with the RF Engineering team to identify, evaluate and mature manufacturing technologies that support the company’s long-term technology roadmap, ensuring future products are scalable, manufacturable and reliable.
The successful candidate will drive process robustness, yield improvement, manufacturability and cost efficiency while supporting new product introduction (NPI) and ongoing production.
Requirements
Key Attributes:
- Analytical and methodical approach
- Strong cross-functional collaboration skills
- Ability to translate technical roadmap requirements into manufacturable solutions
- Comfortable working between development engineering and production operations
- Strong mechanical reasoning and problem-solving capability
- Proactive and hands-on within a manufacturing environment
- Able to operate in a fast-paced scaling organisation
Key Responsibilities:
Technology & Roadmap Support
- Partner with RF Engineering to identify suitable materials, processes and assembly technologies aligned to future product requirements.
- Evaluate emerging die attach and interconnect technologies to support higher power density, higher frequencies and improved thermal performance.
- Provide early manufacturability input into technology roadmap planning.
- Assess scalability, automation potential and cost implications of proposed technologies.
- Lead feasibility trials and proof-of-concept builds for next-generation processes.
- Support make/buy decisions and supplier technology assessment
Die Attach Process Development
- Evaluate and optimise die attach methods including, but not limited to:
- Silver epoxy
- Silver sinter
- Eutectic attach (e.g., AuSn)
- Define process windows (temperature, pressure, time, atmosphere).
- Develop qualification plans and validation methodologies.
- Conduct thermal, mechanical and reliability assessments.
- Characterise voiding, bond line thickness, shear strength and thermal resistance.
- Support material selection and supplier evaluation.
Wire Bonding Process Development & Optimisation
- Develop and optimise gold wire bonding processes (ball and wedge bonding).
- Establish bonding parameters for different metallisation and substrate types.
- Perform pull and shear testing and reliability validation.
- Address intermetallic formation, pad damage and bond integrity challenges.
- Support transition to fine-pitch and high-frequency capable assemblies
Manufacturing Process Development
- Define, document and control new and existing manufacturing processes.
- Develop process flow documentation, SOPs and control plans.
- Implement SPC, Cp/Cpk analysis and yield monitoring.
- Lead root cause investigations using structured methodologies (8D, DMAIC, FMEA).
- Drive continuous improvement initiatives for yield, cycle time and cost reduction.
New Product Introduction (NPI)
- Drive DFM/DFA reviews during product development.
- Develop prototype/pilot builds and process validation plans.
- Work closely with RF, mechanical, quality and operations teams to ensure manufacturability.
- Define tooling, fixturing and automation requirements.
Candidate Requirements:
- Degree in Engineering, Materials Science, Physics or related discipline.
- Experience in semiconductor or RF module assembly processes.
- Hands-on experience with one or more of the following:
- Silver epoxy die attach
- Silver sintering
- Eutectic die attach
- Gold wire bonding
- Understanding of materials behaviour, intermetallic formation and thermal management.
- Experience with process validation and statistical analysis tools.
- Strong problem-solving capability in a manufacturing environment.
Desirable:
- We are particularly interested in candidates from high-precision automotive electronics or power electronics environments who bring transferable skills in automation, process stability, and zero-defect manufacturing culture.
- Experience in high-tech, semiconductor, or manufacturing industries.
- Experience with equipment specification, procurement, and commissioning.
- Knowledge of RF packaging requirements and JEDEC standards.
- Experience with thermomechanical modelling and material reliability testing.
- Experience within electronics manufacturing environment, preferably as a Process Engineer within RF electronic Production/CEM manufacturing organisation.
- Solid grasp of IATF 16949 or ISO 9001; we will provide training for specific standards
Benefits
Please call our Talent Partner, Bruce Mair on 07483 917543 (anytime) if you would like to chat about this role or clarify the salary and benefits prior to investing your time applying.
Filtronic plc is an equal opportunities employer and is committed to building a diverse and inclusive workplace where everyone can thrive. We welcome applications from all qualified candidates regardless of age, gender, ethnicity, religion, sexual orientation, or disability status. If you require any adjustments or accommodations to support you during the interview process, please let us know and we will be happy to assist.
