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Principal Engineer, NAND Advanced Thin Films Process Development at Micron Technology, Inc. · Katori

Asks for

The ad says“Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.”
The ad says“Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.”
The ad says“Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.”
The ad says“Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”
The ad says“Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”
The ad says“Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).”

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Position Overview

The Principal Engineer in Process Development – Advance Thin film plays a critical leadership role in the strategic advancement and implementation of sophisticated structural and electrical film processes for NAND memory technology. This position is responsible for defining technical direction, fostering innovation, and ensuring the successful integration of new processes into manufacturing. The Principal Engineer works collaboratively across multiple teams, contributes to the establishment of technology roadmaps, and delivers solutions that drive next-generation device scaling while supporting the organization’s objectives.

Key Responsibilities

Define and implement the technical strategy for structural and electrical film process development, ensuring alignment with both business and technology objectives.

Lead multi-functional teams in the development, integration, and scaling of thin film processes specifically tailored for advanced NAND structures and devices.

Oversee the end-to-end development of process modules, with a strong focus on manufacturability, scalability, and readiness for integration.

Resolve complex technical challenges that have significant business implications, including root cause analysis and mitigation of process/device failures.

Mentor senior engineers and influence the technical direction throughout the organization, fostering a culture of technical excellence and innovation.

Represent the function in technical forums and participate in strategic collaborations, including industry consortia, technical conferences, and joint development projects.

Deliver solutions that enable and maintain a competitive leadership position in advanced memory technology, including benchmarking against industry standards.

Drive technology transfer and ramp-up activities, ensuring seamless transition from R&D to high-volume manufacturing.

Identify and evaluate emerging trends, risks, and opportunities in structural and electric film technology, providing recommendations for future investments and critical initiatives.

Lead cost reduction, yield improvement, and reliability enhancement programs through innovative process and material utilization.

Technical Expertise

Demonstrated mastery of thin film deposition processes, including Atomic Layer Deposition and Chemical Vapor Deposition, encompassing process design, optimization, and integration for high-density NAND applications.

In-depth knowledge of process-device and mechanical interactions, challenges associated with technology/device scaling, and the principles of reliability engineering for next-generation memory nodes.

Proven track record of developing and implementing novel chemistries, materials, and hardware solutions, such as chamber design, plasma source optimization, and gas delivery systems.

Expertise in advanced characterization techniques, such as X-ray Reflectivity (XRR), ellipsometry, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy (TEM), Secondary Ion Mass Spectrometry (SIMS), and X-ray Photoelectron Spectroscopy (XPS), as well as electrical evaluation methods (including leakage, impedance, capacitance, and breakdown analysis).

Strong foundation in thin film process development using plasma and thermal methods, especially for dielectric (including lowK and highK films), carbon-based films, with an ability to analyze structural-process correlations and conduct failure analysis.

Experience in benchmarking technology, conducting competitive analyses, and assessing industry trends, with the capability to translate complex data into actionable technology roadmaps and process improvements.

Ability to lead cross-disciplinary teams in the development and deployment of new process technologies, including collaboration with integration, device, reliability, and manufacturing engineering groups.

Proficiency in statistical process control (SPC), design of experiments (DOE), and data analytics for process optimization and fixing.

Experience with regulatory compliance, intellectual property management, and technical documentation in a semiconductor manufacturing environment.

Qualifications

PhD or equivalent degree in Materials Science, Chemical Engineering, Physics, Chemistry, Electrical Engineering, or a related field.

5-10 years of experience in Thin Film research and development for NAND process, specifically including CVD and Diffusion Thin Films.

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

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