Asks for

The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Experience with DOEs, process characterization, qualification builds, and failure analysis.”
The ad says“Experience with DOEs, process characterization, qualification builds, and failure analysis.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.”
The ad says“10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.”
The ad says“10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.”
The ad says“10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.”
The ad says“Experience with DOEs, process characterization, qualification builds, and failure analysis.”
The ad says“Experience with DOEs, process characterization, qualification builds, and failure analysis.”
The ad says“10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”
The ad says“Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.”

Principal Advanced Optical Packaging Engineer
Location: Ottawa, Ontario | Type: Full-time

The Opportunity
Ranovus is seeking a Principal Advanced Optical Packaging Engineer to develop and industrialize packaging technologies for next-generation optical engines used in AI and data-center connectivity. This hands-on role covers package/process architecture, flip-chip and BGA assembly, hybrid laser integration, fiber attach, optical alignment, thermal-mechanical risk management, burn-in, tooling, automation, and manufacturing transfer. Working directly with design teams, equipment developers, suppliers, CMs, and OSAT partners.

What You Will Own

Package & Process Architecture: Translate product requirements into packaging/assembly strategies; define build sequences, inspection points, rework, and test gates; lead DFM/DFA/DFT/DFR reviews; identify risks and drive DOEs/qualification.
Flip-Chip, Die Attach & Electrical Integration: Develop/qualify flip-chip and fine-pitch die-attach processes (copper-pillar, BGA, LGA, WLCSP); define reflow, solder paste, flux, and cleaning approaches; manage warpage, CTE mismatch, and voiding; develop underfill/encapsulation processes; define AOI, X-ray, and cross-section inspection methods.
Laser Packaging & Hybrid Integration: Lead hybrid laser-to-carrier and laser-to-ePIC assembly process development; work with laser die, lenses, isolators, and couplers; define alignment, attachment, and burn-in/test flows; manage supplier specs for laser components.
Fiber Attach & Optical I/O: Develop repeatable fiber-array attach processes (single-mode, PM fiber, multi-fiber arrays); define alignment strategy, adhesive/cure processes, and loss-control methods; support automated fiber-attach station development (motion, vision, dispensation, calibration).
Thermal-Mechanical & Materials: Evaluate thermal paths and manage package stress/warpage/CTE mismatch; select and qualify solders, underfills, adhesives, TIMs, and encapsulants; partner with mechanical/simulation specialists.
NPI & Manufacturing Transfer: Lead processes from POC through NPI, qualification, and production ramp; define tooling, SOPs, PFMEAs, and control plans; drive root-cause/corrective action; decide what stays in-house vs. transfers to partners

Required Experience

10+ years in advanced optical packaging, photonic packaging, optoelectronic assembly, semiconductor packaging, or precision micro-assembly.
Demonstrated ownership of packaging processes from development through NPI/production transfer.
Hands-on experience in several flip-chip bonding, fine-pitch die attach, copper-pillar/solder-bump interconnect, BGA/LGA assembly, substrate/interposer integration, laser die/subassembly packaging, fiber-array attach, active/passive optical alignment, underfill/encapsulation/adhesive processes.
Strong grasp of how optical, mechanical, thermal, electrical, material, and manufacturing requirements interact in an optoelectronic package.
Practical knowledge of soldering, wetting, flux, intermetallics, surface finishes, underfill, adhesives, curing, and contamination control.
Experience with DOEs, process characterization, qualification builds, and failure analysis.
Experience defining process windows, inspection criteria, and manufacturing controls.
Ability to distinguish lab demonstrations from robust, transferable manufacturing processes.
Experience with external manufacturing partners, equipment suppliers, or component vendors.
Strong technical judgment and communication skills.

Particularly Valuable Experience

Laser/laser-array/hybrid laser-photonic subassembly packaging; co-packaged or external laser sources.
Single-mode edge coupling, lensed coupling, mode-field conversion, isolators, turning optics.
Laser characterization, chip-on-carrier test, burn-in, reliability qualification.
Silicon photonics packaging for transceivers/optical engines (800G–6.4T+).
Automated optical alignment equipment (e.g., FiconTEC); motion control, machine vision, force sensing, UV curing.
Organic substrates, advanced interposers, high-density BGA connectors.
Thermal-mechanical modeling (warpage, stress, CTE, solder-joint reliability).
SPC, MSA, GR&R, Cp/Cpk, yield improvement.
CAD experience (SolidWorks or comparable).

Education
Bachelor's in Mechanical, Materials, Electrical Engineering, Physics, Optics, Photonics, Packaging Engineering, or related field required; Master's/PhD preferred. Deep relevant experience may substitute for an advanced degree.

The Successful Candidate
Someone who has personally built and debugged complex optoelectronic hardware who is able to explain not just what process was used, but why, what the failure mechanisms were, and how it was transferred to manufacturing. Comfortable moving between architecture-level and hands-on assembly discussions, and capable of bringing the right specialists together to reach engineering decisions.

Asks for

Values