Asks for

The ad says“Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production.”
The ad says“Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent).”
The ad says“Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.”
The ad says“Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).”
The ad says“Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).”
The ad says“Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.”
The ad says“Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.”
The ad says“Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.”
The ad says“Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.”
The ad says“Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.”
The ad says“Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.”
The ad says“Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis.”
The ad says“Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.”
The ad says“Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent).”
The ad says“Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules).”
The ad says“Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules).”
The ad says“Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis.”
The ad says“Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).”
The ad says“Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.”
The ad says“Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.”
The ad says“Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies.”

About Ubiquiti

At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity.

Responsibilities

Lead hardware circuit design, schematic capture, and layout review for next-generation, high-density, and high-throughput networking platforms.
Evaluate and integrate advanced switching architectures, management subsystems, and cutting-edge high-speed interconnect technologies.
Drive hardware architecture design, system bring-up, high-speed signal integrity (SI) validation, and root-cause failure analysis.
Partner with mechanical, thermal, and power engineering teams to address challenges related to high power density, thermal dissipation, and system-level reliability.
Own BOM structure and support factory deployment to ensure seamless transition of high-layer-count PCBAs from NPI to mass production.
Collaborate with cross-functional software, firmware, QA, and compliance teams throughout the entire product lifecycle.

Qualifications

Bachelor’s degree or above in Electrical Engineering or a related discipline.
5+ years of hands-on experience in high-complexity system-level hardware design, ideally focused on enterprise-grade networking or high-performance infrastructure equipment.
Deep technical understanding of high-speed Ethernet design, high-speed differential signals (advanced SerDes, PCIe, multi-gigabit/ultra-high-speed interfaces), and high-density PCB design rules.
Practical experience with complex power delivery networks (PDN), power integrity, and high-reliability system architectures (e.g., redundant power systems, hot-swappable modules).
Hands-on proficiency in hardware validation, signal integrity measurement, debugging, and failure analysis.
Familiarity with international compliance and environmental standards (EMC/EMI, ESD, Safety).
Proficiency with standard EDA tools (OrCAD Capture, Cadence Allegro, or equivalent).

Nice to Have

Experience with advanced system management architectures (e.g., remote management controllers and out-of-band management protocols).
Knowledge of high-power density board design, advanced chassis thermal solutions, or modular architecture.

Asks for

Values