Asks for

The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Experience in lab management, shift resource planning, and budgeting.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Experience in lab management, shift resource planning, and budgeting.”
The ad says“8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.”
The ad says“Proven technical leadership and people management capability.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of semiconductor or advanced packaging manufacturing processes.”
The ad says“Experience in lab management, shift resource planning, and budgeting.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”
The ad says“Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.”

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

Job Description

As Package Characterization Lab Manager within Advanced Packaging Technology Development (APTD), you will lead a high-performing team of shift engineers and technicians delivering package characterization and failure analysis (FA) support for leading-edge technology development in advanced packaging. You will provide technical direction, own lab operational excellence and workforce development, ensuring timely, high‑quality results that directly impact critical APTD technical decisions. This role partners closely with Micron's global engineering labs, subject-matter experts and external vendors to expand lab capability, efficiency and ensure forward-looking readiness for new technologies.

Responsibilities and Tasks

Lab Management, Compliance & Audits

Lead Package Characterization lab operations to meet key performance metrics, cycle-time and safety standards.
Plan and optimize FA lab equipment, space, and budget to support current and future needs with high utilization efficiency.
Coordinate timely equipment calibration (external vendors), repairs, and spare parts procurement to ensure sustained equipment uptime.
Evaluate and introduce new FA tool models and capabilities in partnership with vendors and Micron subject‑matter experts.
Lead various EHS, quality, TS, ISO14001, OHSAS, and customer audits with a strong safety‑first culture.

Technical Leadership & Cross‑Functional Partnership

Provide technical mentorship and drive continuous improvement of package characterization methodologies and procedures.
Collaborate cross‑site to benchmark, standardize best-known methods to improve lab efficiency and effectiveness.
Ensure FA lab readiness for new product designs and technologies.
Align task priorities and execution with APTD team members, providing recommendations for optimal lab tool/resource usage.
Deliver timely, clear, and actionable package analysis insights to enable data‑driven technical and business decisions.

Workforce Development & Performance Management

Build and sustain a robust training and development program, including hands‑on FA casework, cross‑site learning, and leadership mentoring.
Define, track, and review performance metrics to identify gaps, drive accountability, and build a high‑performing team.
Provide mentorship, regular coaching, communication and career development for lab engineers and technicians.

Requirements

Bachelor’s degree or higher (Master’s/PhD preferred) in Materials Science, Physics, Chemistry, or related field.
8+ years of experience in semiconductor package characterization (physical/thermal/chemical) and failure analysis field.
Knowledge of package FA tools and techniques including SEM, EDX, FIB, TEM, AFM, FTIR, XPS, X‑ray, CSAM, ion milling, delayering, and decapsulation.
Knowledge of semiconductor or advanced packaging manufacturing processes.
Experience in lab management, shift resource planning, and budgeting.
Proven technical leadership and people management capability.
Strong written and verbal communication skills with a customer‑focused mentality

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_sg@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.