Asks for

The ad says“Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures”
The ad says“Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.”
The ad says“We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.”
The ad says“We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.”
The ad says“Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.”
The ad says“Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.”
The ad says“Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.”
The ad says“We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.”
The ad says“We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.”
The ad says“Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures”
The ad says“Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures”
The ad says“Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.”
The ad says“Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.”

About Lyte

Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai

If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!

About the role

We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field.

What you'll do

Lead Asia operation team working with OSATs, assembly houses, PCBA lines to support NPI and volume production.

Working closely with HQ RnD and operation team to implement wafer level probe tests at OSATs to identify known good dies.

Working with HQ team to support device packaging process improvement with Cp and Cpk increase.

Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after burnin.

Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production.

Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and system reliability tests.

Write technical documentation for test implementation, reports, and present results to internal and external stakeholders.

Intime make technical and project decision.

Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures

Manage and expand the Asia operation team when needed.

Required Qualifications

Minimal requirement is a bachelor's degree with 12 years of experience.

Device test knowledge and experience for at least some following areas for: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA.

Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly.

A fast learner is a must.

Good work ethics and maintaining the company’s confidential information are a must.

Preferred Qualifications

A higher degree with more experience is highly desired.

Experience on optoelectronic device tests such as those for optical engines in pluggable modes and pluggable modules is a plus.

Experience and knowledge of silicon photonic devices and IIIV CoC reliability is a huge plus.

Experience of the setup and implementation of tests for NPI and volume production is a big plus.

Experience in the process of automation and test automation is a plus.

Data analysis experience such as JMPs is a plus;

Benefits (subject to location and local regulations)

Competitive salary and equity
Flexible vacation and time-off policy
Collaborative, fast-paced, and inclusive work environment
Opportunity to work on cutting-edge technologies with a highly cross-functional team

Asks for

Values