Asks for

The ad says“Knowledge of high-speed host interfaces such as 100G/200G-per-lane PAM4”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Bring up optical interfaces on the accelerator card and debug link issues using BERTs, sampling scopes, and OSAs”
The ad says“Expertise across advanced optical interconnect architectures, including Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Optical Compute Interconnect (OCI), Linear Pluggable Optics (LPO), and emerging form factors (XPO)”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Working knowledge of laser sources, modulators, TIAs, and DSPs/retimers”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Working knowledge of laser sources, modulators, TIAs, and DSPs/retimers”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Expertise across advanced optical interconnect architectures, including Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Optical Compute Interconnect (OCI), Linear Pluggable Optics (LPO), and emerging form factors (XPO)”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Comfort co-designing optical engines alongside the ASIC, substrate, package, and cold-plate-integrated liquid cooling solutions”
The ad says“Working knowledge of laser sources, modulators, TIAs, and DSPs/retimers”
The ad says“Expertise across advanced optical interconnect architectures, including Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Optical Compute Interconnect (OCI), Linear Pluggable Optics (LPO), and emerging form factors (XPO)”
The ad says“Conversant in relevant industry standards and MSAs (OCI, Open CPX, OIF, UCIe)”
The ad says“Conversant in relevant industry standards and MSAs (OCI, Open CPX, OIF, UCIe)”
The ad says“Conversant in relevant industry standards and MSAs (OCI, Open CPX, OIF, UCIe)”
The ad says“Expertise across advanced optical interconnect architectures, including Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Optical Compute Interconnect (OCI), Linear Pluggable Optics (LPO), and emerging form factors (XPO)”
The ad says“5–10 years of experience in optical interconnect, transceiver, or photonic system design and development for high-density compute systems”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“Bring up optical interfaces on the accelerator card and debug link issues using BERTs, sampling scopes, and OSAs”
The ad says“Experience with traditional pluggable solutions (OSFP, QSFP-DD)”
The ad says“Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining”
The ad says“5–10 years of experience in optical interconnect, transceiver, or photonic system design and development for high-density compute systems”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”
The ad says“Experience with traditional pluggable solutions (OSFP, QSFP-DD)”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Bring up optical interfaces on the accelerator card and debug link issues using BERTs, sampling scopes, and OSAs”
The ad says“Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability”
The ad says“Working knowledge of laser sources, modulators, TIAs, and DSPs/retimers”
The ad says“5–10 years of experience in optical interconnect, transceiver, or photonic system design and development for high-density compute systems”
The ad says“Conversant in relevant industry standards and MSAs (OCI, Open CPX, OIF, UCIe)”
The ad says“Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration”

About Etched

Etched is building hardware for frontier intelligence. We co-design chips, racks, software, and manufacturing to deliver best-in-class throughput and latency across both prefill and decode workloads. Our first products are heavily focused on inference. Backed by hundreds of millions from top-tier investors and staffed by leading engineers, Etched is redefining the infrastructure layer for the fastest growing industry in history.

Job Summary

Etched is looking for an exceptional Optical Systems Engineer to join our team. In this role, you will own the definition and implementation of the optical interconnect architecture for our next-generation accelerator systems and help us scale our manufacturing capabilities.

Key Responsibilities

Lead optical link architecture and system design for Etched's accelerator systems
Evaluate and integrate next-generation interconnect technologies (such as NPO, CPO, and OCI) into our product roadmap
Drive prototypes through definition, validation, and the transition to volume production
Partner with Signal Integrity, PCB, ASIC, Thermal, and Mechanical Engineering teams to implement electrical-optical interfaces in high-performance AI servers
Engage optical module, laser, and PIC suppliers on specifications, qualification, and integration
Capture multi-rack interconnect requirements including topology, reach, connectors, and fiber management to ensure our products meet them
Bring up optical interfaces on the accelerator card and debug link issues using BERTs, sampling scopes, and OSAs
Define optical bring-up strategies and equipment while supporting test development for high-volume manufacturing
Own optics-related documentation, including AVLs, fiber/cable BOMs, serviceability guidelines, and assembly procedures

You may be a good fit if you have (Must-have qualifications)

5–10 years of experience in optical interconnect, transceiver, or photonic system design and development for high-density compute systems
Expertise across advanced optical interconnect architectures, including Co-Packaged Optics (CPO), Near-Packaged Optics (NPO), Optical Compute Interconnect (OCI), Linear Pluggable Optics (LPO), and emerging form factors (XPO)
Clear understanding of architectural tradeoffs across these technologies: energy-per-bit, bandwidth density, reach, latency, serviceability, and reliability
Strong fundamentals in optical link engineering, including link-budget analysis, IL/RL, OSNR, eye diagrams, jitter, BER, and FEC margining
Working knowledge of laser sources, modulators, TIAs, and DSPs/retimers
Knowledge of high-speed host interfaces such as 100G/200G-per-lane PAM4
Experience with traditional pluggable solutions (OSFP, QSFP-DD)
Deep familiarity with photonic-electronic co-design and advanced packaging methods, such as fiber-attach (edge couplers, grating couplers, V-groove FAUs, detachable optical connectors), optical interposers, and 2.5D/3D heterogeneous integration
Comfort co-designing optical engines alongside the ASIC, substrate, package, and cold-plate-integrated liquid cooling solutions
Conversant in relevant industry standards and MSAs (OCI, Open CPX, OIF, UCIe)
Proven track record of bringing up optical links and PIC-based subsystems alongside silicon, including root-cause debugging with PIC foundries, ELS vendors, and OSATs
Deep understanding of datacenter infrastructure, specifically high-power (>10 kW) liquid-cooled AI servers and cluster-scale optical fabrics
Passionate about modern AIs like ChatGPT, and willing to learn about them on the job

Benefits

Medical, dental, and vision packages with generous premium coverage
- $500 per month credit for waiving medical benefits
Housing subsidy of $2,500 per month for those living within walking distance of the office
Relocation support for those moving to San Jose (Santana Row)
Various wellness benefits covering fitness, mental health, and more
Daily lunch and dinner in our office
Unlimited compute budget subject to ROI justification

How we’re different

Etched believes in the Bitter Lesson. We are the first inference-focused frontier AI system. Our addressable market is the entirety of inference, unlike many of our competitors.

We are a fully in-person team in San Jose and Taipei, and greatly value engineering skills. We do not have boundaries between engineering and research, and we expect all of our technical staff to contribute to both as needed.