Asks for

The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”
The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”
The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”
The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”
The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”
The ad says“• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.”

Values

The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”
The ad says“• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.”

Job Details:

Job Description:

As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules.

Responsibilities may include but not be limited to:

• Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification.

• Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability.

• Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve goals.

• May necessitate the development of improved/new tools and BKM methods. Provide lab hub support to new process/product ramp in HVM factories and production startup.

This position is not eligible for Intel immigration sponsorship

Qualifications:

Minimum Qualifications:
• Bachelor's degree in Material Science, STEM related to Semi. Mfg. AND 2+ years maintenance experience -OR- Associate degree STEM related to Semi. Mfg. AND 4+ years maintenance experience

Preferred qualifications:
• 5+ years of experience working in a semiconductor manufacturing facility or lab facility.
• 1+ years of experience in one or more of the following areas: AFM, and x-ray analysis/diffraction (TXRF, XRF, XRD/XRR), surface analysis (XPS, SIMS/TOFSIMS), electron spectroscopy and imaging (SEM/TEM/EDX), and FIB techniques is highly desired.
• Familiarity with laboratory techniques.

Job Type:

Experienced Hire

Shift:

Shift 7 (United States of America)

Primary Location:

US, Oregon, Hillsboro

Additional Locations:

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel.

Annual Salary Range for jobs which could be performed in the US: $60,450.00-85,340.00 USD (Hourly Role)

The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.

Work Model for this Role

This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.