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Manager, Semiconductor IC Packaging & Assembly Engineering at Renesas Electronics · Katori

Asks for

The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”
The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”
The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.”
The ad says“Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.”

Job Description

We are seeking an experienced Manager of Semiconductor IC Packaging Assembly Engineering to support assembly sustaining engineering and manufacturing execution for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, including Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional exposure to wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This position will focus on yield improvement, process stability, quality support, process change execution, and manufacturing readiness while working closely with Package Engineering, Product Engineering, Quality, Supply Chain, and external OSAT partners to support New Product Introduction (NPI) transfer into high-volume manufacturing (HVM).

The ideal candidate combines strong semiconductor packaging assembly knowledge with hands-on technical execution, structured problem solving, and cross-functional coordination skills to improve manufacturing performance, product quality, and process robustness. This role serves as a technical contributor and coordination point between Package Engineering and manufacturing partners by helping translate package development requirements, qualification plans, process controls, and ramp readiness needs into reliable manufacturing execution.

Key Responsibilities:

Manufacturing & Sustaining Engineering Execution

Support sustaining engineering activities across semiconductor package assembly technologies and assigned product lines.
Execute manufacturing improvement activities related to yield, cycle time, quality, throughput, and cost.
Apply engineering practices for process control, defect reduction, and continuous improvement.
Provide technical input to assembly engineering plans aligned with package technology and product needs.
Work with Package Engineering and OSAT teams to support manufacturable designs and stable production controls.

Yield Monitoring & Continuous Improvement

Monitor assembly yield performance, trends, and corrective action progress.
Support data-driven yield improvement activities using statistical and structured problem-solving methodologies.
Investigate process, reliability, and customer quality issues through disciplined root-cause analysis.
Maintain and review KPIs and dashboards to track manufacturing performance and improvement progress.

Quality & Reliability Management

Work with Quality and Reliability teams to support internal, industry, and customer requirements.
Support containment, corrective, and preventive actions for manufacturing and field quality issues.
Support process controls and qualification requirements across OSAT sites.
Support customer, supplier, and internal quality audits and reviews.
Work with manufacturing partners to resolve issues and support shipment of qualified products.

Process Change Management

Support process change management for materials, equipment, tooling, flows, and sites.
Assess engineering changes for technical, quality, reliability, supply, and operational impact.
Support qualification plans for transfers, second sourcing, equipment changes, and cost reductions.
Maintain documentation, change control records, and manufacturing readiness materials.

NPI to High Volume Manufacturing Ramp

Support manufacturing engineering activities for NPI-to-production transfers.
Participate in manufacturability reviews and package-process integration discussions during product development.
Support manufacturing readiness, process optimization, and structured ramp execution for new products.
Support process, qualification, material, site, and capacity readiness for high-volume ramp.
Coordinate ramp execution tasks with engineering, supply chain, and quality teams.

OSAT Partner Management

Work with global OSAT and contract manufacturing partners supporting development and production activities.
Track partner performance related to yield, quality, cycle time, reliability, and capacity readiness.
Participate in technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners.
Collaborate with suppliers and OSAT partners on transfers, process optimization, scaling, and cost improvement activities.

Team Collaboration & Technical Support

Provide technical support and guidance to engineering team members on assigned projects and issues.
Promote collaboration, technical discipline, accountability, and continuous improvement within project teams.
Help improve engineering processes and technical practices to support product and manufacturing needs.
Support knowledge sharing and technical capability growth within the engineering organization.
Contribute packaging assembly expertise to support product execution, customer readiness, and manufacturing ramp.

Qualifications

Required Qualifications:

Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
12+ years of semiconductor manufacturing and packaging engineering experience with exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
5+ years of experience leading technical projects, coordinating engineering activities, or mentoring engineers in semiconductor manufacturing environments.
Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.
Strong understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.
Experience working with global OSAT partners and outsourced manufacturing ecosystems, including qualification support and ongoing technical coordination with subcontractors and contract manufacturers.
Experience supporting NPI-to-HVM product ramp execution.
Strong knowledge of semiconductor quality systems, change management, and qualification methodologies.
Strong analytical, organizational, communication, and cross-functional collaboration skills.

Preferred Qualifications:

Master’s degree or PhD in Engineering or related field.
Experience with advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB.
Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.
Experience working with geographically distributed engineering teams and manufacturing operations.
Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.