Description

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history.

Northrop Grumman Mission Systems (NGMS) Sector is seeking a Manager Programs 2 to join the Northrop Grumman Microelectronics Center (NGMC) to support the Foundry, Test, and Advanced Packaging Operating Unit’s Advanced Packaging team. The position will be onsite in Linthicum, MD.

For more than 70 years, Northrop Grumman’s Microelectronics Center, part of Northrop Grumman Mission Systems, has pushed the boundaries in this ever-evolving field of microelectronics. Our U.S.-based, government-trusted foundries and state-of-the-art advanced packaging facilities set the standard, designing and delivering millions of defense and commercial microelectronics components each year. From innovative design to precise fabrication, our mission-tailored solutions provide unparalleled performance, ensuring our technology meets the most demanding challenges.

The Advanced Packaging team develops and deploys next-generation microelectronics packaging technologies for future defense systems. We focus on development, prototyping, maturation, and scaling of advanced packaging technologies to meet the needs of our sectors and their operating divisions.

What You'll Get To Do:

The selected candidate will be responsible for shaping, capture, and execution of advanced packaging technology development, prototyping, and maturation programs. The selected candidate will be responsible for numerous aspects of the program including: managing cost, schedule, and technical performance of the program; leading interfaces with internal and external customers, supplier partners, and company support organizations; supporting insertion of these technologies into other IRAD, CRAD, or production programs; identifying growth opportunities and play significant roles in bid and proposal activities; and interfacing with technical leadership across Northrop Grumman to identify technology needs and timelines to support next-generation systems.

The selected candidate will own the delivery of all contractual requirements on cost and on schedule, while achieving all technical requirements and creating customer intimacy to support value creation strategies and actions.

Program Managers are responsible for leading all phases of the program life cycle from inception (proposal development) through startup, execution, and completion (contract closeout).  Primary responsibilities are the management of cost, schedule, and technical performance of company programs or subsystems and include, but are not limited to:

Cultivating customer relationships and intimacy to develop further opportunities within the customer community.
Developing new business opportunities through long term strategic planning, capture planning, and development of proposals and business plans.
Establishing a program organization that effectively addresses customer requirements and incorporates the necessary internal and external sub-organizations.
Leading and directing cross-functional Integrated Program Teams (IPT) to meet program cost, schedule and technical performance objectives.
Measuring and reporting program performance.
Delivering presentations to customers, executive management and other program stakeholders.
Participating in the negotiation of contracts, contract changes, specifications, operating budgets, schedule milestones, and key terms and conditions.
Establishing design concepts, criteria, and engineering efforts for product research, development, integration and test.
Creation, review and finalization of the program Statement of Work.
Identification, distribution, tracking, and completion of program requirements.
Establishment and management of the program and subordinate baselines.
Development and adherence to budget baselines utilizing Earned Value Management (EVM) or similar cost & schedule control methodologies and tools.
Identifying, allocating and managing program resources, including workforce planning.
Managing Government/customer supplied property or information (GFE, CFE, etc.)
Managing suppliers to meet program objectives.
Adherence to all internal processes, policies, and applicable industry standards.
Ensuring program team understands and adheres to contract scope, and manages change through control board activities.
Development and adherence to master plans and schedules.
Conducting thorough risk & opportunity management practices including identification, mitigation and realization.

Basic Qualifications:

Bachelor’s Degree and 8+ years of relevant experience, or Master’s Degree and 6+ years of relevant experience, or a PhD and 3+ year of relevant experience supporting U.S. Government contracts and customers and/or project management in commercial industry.
Demonstrated experience leading teams in the performance of tasks on schedule, at cost and achieving all requirements as either project lead, integrated program team or cost account manager.
Demonstrated technical experience supporting the research, development, production, and deployment of microelectronics and advanced packaging technologies.
Demonstrated verbal and written communication skills through development and delivery of white papers, proposals, technical presentations, customer briefings, and program reviews.
Demonstrated experience utilizing Earned Value Management (EVM), integrated schedule, and Agile methodologies to support program execution, cost/schedule performance tracking and risk management.
Ability to travel domestically as required based on program and business requirements.
U.S. Citizenship required.
Active U.S. Government Secret clearance required to be considered, the ability to obtain and maintain a Special Access Programs (SAPs), and the ability to occasionally travel on-site to work in classified areas.

Preferred Qualifications:

Master’s or Ph.D. degree in a science or technology field related to microelectronics and semiconductors.
Demonstrated experience managing the research, development, and manufacturing of microelectronics and advanced packaging.
Demonstrated experience interfacing with U.S. Government, defense, and commercial customers to define technical solutions for their microelectronics fabrication and/or packaging needs.
Demonstrated knowledge of those customers' planning, program creation, and program management processes.
5+ years of experience leading semiconductor technology development or production programs, operations management, knowledge of RF & digital system products, capabilities and enabling technologies.
Familiarity with Federal Acquisition Regulations (FAR) and Defense Federal Acquisition Regulations (DFAR).
Active U.S. Government Top Secret clearance.

What We Can Offer You

Northrop Grumman provides a comprehensive benefits package and a work environment which encourages your growth and supports the mutual success of our people and our company. Northrop Grumman benefits give you the flexibility and control to choose the benefits that make the most sense for you and your family. Your benefits will include the following: Health Plan, Savings Plan, Paid Time Off and Additional Benefits including Education Assistance, Training and Development, 9/80 Work Schedule (where available), and much more!

Primary Level Salary Range: $153,800.00 - $230,800.00

The above salary range represents a general guideline; however, Northrop Grumman considers a number of factors when determining base salary offers such as the scope and responsibilities of the position and the candidate's experience, education, skills and current market conditions.

Depending on the position, employees may be eligible for overtime, shift differential, and a discretionary bonus in addition to base pay. Annual bonuses are designed to reward individual contributions as well as allow employees to share in company results. Employees in Vice President or Director positions may be eligible for Long Term Incentives. In addition, Northrop Grumman provides a variety of benefits including health insurance coverage, life and disability insurance, savings plan, Company paid holidays and paid time off (PTO) for vacation and/or personal business.

The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.

Northrop Grumman is an Equal Opportunity Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO and pay transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.

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