Asks for

The ad says“Tools: Altium / A365, PLM systems (Arena PLM preferred)”
The ad says“Tools: Altium / A365, PLM systems (Arena PLM preferred)”
The ad says“Camera systems: CMOS sensors, synchronization, image acquisition.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“DFM: good understanding of design rules vs. cost, supplier test methods & equipment.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“Camera systems: CMOS sensors, synchronization, image acquisition.”
The ad says“Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.”
The ad says“Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.”
The ad says“Test equipment: Oscilloscope, logic analyzer, spectrum analyzer, power analyzer.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“Test equipment: Oscilloscope, logic analyzer, spectrum analyzer, power analyzer.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“Tools: Altium / A365, PLM systems (Arena PLM preferred)”
The ad says“Test equipment: Oscilloscope, logic analyzer, spectrum analyzer, power analyzer.”
The ad says“Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Test equipment: Oscilloscope, logic analyzer, spectrum analyzer, power analyzer.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Camera systems: CMOS sensors, synchronization, image acquisition.”
The ad says“Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.”
The ad says“High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”
The ad says“Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.”

Job Description

Lead Electronics Engineer – Camera & FPGA-Based Consumer Electronics

Position Summary
We are seeking an experienced Lead Electronics Engineer to lead the design and development of advanced camera-based consumer electronic products utilizing high-speed digital electronics, based on SoC / FPGA technology, and image sensors. The successful candidate will be responsible for the complete electronic hardware development lifecycle, from concept through production, working closely with FPGA, firmware, mechanical, optical, software, manufacturing, and quality engineering teams.

Primary Responsibilities

Define electronics architecture: collaborate with firmware and other cross functional teams on design considerations.
Design complex, high-speed, multilayer PCBs utilizing SoCs, DDR. Conduct design reviews of other team members layout, considering design rules, clock tree, SI/PI, and EMI/EMC.
Collaborate with Firmware team on FPGA integration including DDR, interfaces, and timing.
Circuit design, schematic capture and reviews.
Oversight and meticulous attention to symbols, footprints & all library management.
Lead prototype bring-up, validation, debugging, and thermal testing.
Support manufacturing with DFM, DFT, and yield improvement.
Work with certification lab to ensure regulatory compliance (FCC, CE, UKCA, EMC, Safety, RoHS, CRA, RED).
Collaborate across engineering, manufacturing, quality, supply chain, and program management.

Required Qualifications

B.S. in Electrical Engineering required; M.S. preferred.
10+ years of hardware design experience.
Experience bringing consumer electronics from concept to production.
Expertise with SoC / FPGA-based systems, camera integration, and high-speed, multilayer PCB design.

Required Technical Skills

High-speed digital design (DDR, FPGA, timing, SI). Understanding of stack-up and material selection, controlled impedance.
Interfaces: USB 3.x, Ethernet, PCIe, DisplayPort, MIPI, SPI, I2C, UART.
Camera systems: CMOS sensors, synchronization, image acquisition.
Power electronics: Strong in DC/DC switching supplies, troubleshooting and design trade-offs. Good understanding of LDOs, Lithium batteries, power sequencing, thermal design.
DFM: good understanding of design rules vs. cost, supplier test methods & equipment.
Tools: Altium / A365, PLM systems (Arena PLM preferred)
Test equipment: Oscilloscope, logic analyzer, spectrum analyzer, power analyzer.
Thorough understanding of change management / ECO, accross full product life cycle.

Preferred Experience

Complex consumer electronics, digital imaging, Linux embedded systems, AMD Xilinx Zynq, NPI, contract manufacturing.

Soft Skills

Leadership, communication, mentoring, ownership, collaboration, multitasking.

Ideal Candidate

Experienced designing sophisticated camera-based, FPGA-centric consumer electronics from concept through mass production.

#LI-BC1

#ForesightSports

Pay Range:

Annual Salary: $150,000.00 - $170,000.00

The actual annual salary offered to a candidate will be based on variables including experience, geographic location, education, and skills/achievements, and will be mutually agreed upon at the time of offer.

We offer a highly competitive salary, comprehensive benefits including: medical and dental, vision, disability and life insurance, 401K, PTO, paid holidays, gear discounts and the ability to add value to an exciting mission!

Our Postings are not intended for distribution to or use in any jurisdiction, country or territory where such distribution or use would violate local law or would subject us to any regulations in another jurisdiction, country or territory. We reserve the right to limit our Postings in any jurisdiction, country or territory.

Equal Opportunity Employer Protected Veteran/Disabled