IC Package Mechanical FEA Engineer (R&D)

• Design responsibility for mechanical design aspects of ASIC packages

• Use advanced FEA to quantify and optimize reliability and manufacturing

• Measure and experiment to validate understanding and improve model accuracy

• Collaborate closely with package designers, reliability and manufacturing partners (internal and external) 

• Schedule, prioritize, & track your work across 4+ projects simultaneously

• Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors

• Document design rules and guidelines 

EDUCATION/EXPERIENCE & REQUIREMENTS:

• Bachelors in Mechanical Engineering or similar field and 8+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 6+ years of experience  in FEA modeling or PhD in Mechanical Engineering or similar field and 3+ years of experience in FEA modeling.

• Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions 

• Ability to calibrate modeling and results with existing empirical data 

• Perform mechanical testing and measurement

• Devise lab scale tests to validate analyses

• Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations

• Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK

• Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers

• Self-management and organization skills

• Presentation and technical documentation skills