1.54M jobs liveBrowse

Director, Advanced Package Assembly and Test Engineering (Taiwan Supplier Development ) at GLOBALFOUNDRIES SINGAPORE PTE. LTD. · Katori

Asks for

The ad says“15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Excellent communication skills in English; Mandarin Chinese capability is strongly preferred for supplier engagement, customer engagement, and local talent recruiting.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Proven people management experience, with direct responsibility for hiring, developing, coaching, and leading a technical engineering team, ideally in Taiwan or the broader Asia semiconductor ecosystem.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”
The ad says“15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.”
The ad says“15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.”
The ad says“Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.”

About GF

GlobalFoundries (GF) is a leading manufacturer of essential semiconductors, enabling AI at scale from the cloud to the physical world. Through deep partnerships with customers, GF delivers differentiated, power efficient and high performance solutions for high growth markets. With global manufacturing operations across the U.S., Europe and Asia, GF is a trusted and holistic technology partner for customers around the world. GF’s talented, global team remains focused every day on security, longevity and sustainability. For more information, visit www.gf.com.

Introduction

We are seeking a Director level Advanced Package Assembly and Test Engineering leader based in Taiwan to build, recruit, and lead a high performing team of 5 to 6 advanced package assembly and test engineers. This leader will be co located with the supplier in Taiwan and will serve as the primary technical, execution, and business interface with the supplier, driving development work, engineering discipline, schedule acceleration, yield learning, failure analysis, and manufacturing readiness for advanced packaging programs.

The successful candidate will combine deep technical expertise in advanced semiconductor packaging and assembly/test engineering with strong people leadership, supplier development capability, customer and business engagement, and the ability to recruit and retain top engineering talent in Taiwan. This role requires a leader who can manage and grow a technical team, operate at supplier depth, build trusted relationships with customers and business stakeholders, and create a local engineering presence capable of accelerating development cycles and improving execution.

Key Responsibilities

Team and People Leadership

Build, manage, and develop a Taiwan based team of 5 to 6 advanced package assembly and test engineers, with direct responsibility for hiring, coaching, performance management, and career development.
Establish a strong engineering culture and execution model that scales with current programs and future advanced packaging opportunities.
Serve as the people manager of record for the Taiwan team, setting goals, conducting reviews, and developing succession within the team.

Supplier and Technical Execution

Serve as the senior technical and operational interface, driving day to day engineering alignment, issue resolution, development execution, and supplier accountability.
Lead advanced packaging assembly and test development activities across package architecture, process integration, NPI, qualification, reliability, yield improvement, and production ramp.
Establish rigorous engineering operating mechanisms with the supplier, including technical reviews, milestone tracking, risk management, data driven problem solving, and clear escalation paths.
Drive rapid learning cycles for assembly and test development, with focus on reducing cycle time, improving yield, resolving quality issues, and accelerating customer program milestones.
Lead root cause analysis and corrective action for assembly, package integration, test, reliability, and yield excursions, including use of structured failure analysis and 8D methodologies.

Customer and Business Engagement

Build and maintain trusted relationships with customers to understand packaging requirements, program priorities, and roadmap needs relevant to the Taiwan supplier scope.
Represent GF in customer technical reviews and program discussions where supplier execution, schedule, or quality is a topic of direct customer interest.
Partner with Product Line Management, Program Management, and Business Development to ensure supplier execution stays aligned to business priorities and customer commitments.
Communicate program status, risks, and business impact to internal senior leadership and, where appropriate, directly to customer stakeholders.

Cross Functional Partnership

Partner closely with internal product line, technology development, design, test, quality, reliability, procurement, and program management teams to ensure supplier execution is aligned to business and customer priorities.
Represent engineering leadership in supplier reviews, executive updates, customer program discussions, and cross functional decision forums.

Required Qualifications

15+ years of experience in semiconductor packaging, assembly engineering, package development, test engineering, supplier engineering, or related advanced manufacturing roles.
Bachelor's degree in Materials Science, Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or a related technical field; advanced degree preferred.
Proven people management experience, with direct responsibility for hiring, developing, coaching, and leading a technical engineering team, ideally in Taiwan or the broader Asia semiconductor ecosystem.
Demonstrated experience building and maintaining direct customer relationships, including customer facing technical or program discussions. i
Deep hands on technical understanding of advanced package assembly and test processes, including one or more of WLCSP, fan out wafer level packaging, TSV, flip chip, Cu pillar, micro bump, die attach, substrate based packages, heterogeneous integration, or related advanced package technologies.
Strong experience working directly with OSAT suppliers, especially in Taiwan, with demonstrated ability to influence supplier priorities, engineering discipline, technical execution, and schedule performance.
Experience with NPI, qualification, process development, yield improvement, reliability testing, failure analysis, supplier audits, quality systems, and manufacturing ramp support.
Demonstrated ability to operate as a technical leader at the supplier site while also communicating effectively with senior internal stakeholders, business partners, and customer facing program teams.
Strong recruiting network and credibility within Taiwan's semiconductor packaging, OSAT, assembly/test, and supplier engineering talent market.
Excellent communication skills in English; Mandarin Chinese capability is strongly preferred for supplier engagement, customer engagement, and local talent recruiting.

Preferred Experience

Prior leadership role at or closely partnered with ASE, a major OSAT, IDM, fabless semiconductor company, or foundry with advanced packaging programs.
Experience building a new technical team or engineering function from the ground up.
Experience supporting high priority customer programs requiring aggressive schedule recovery, supplier acceleration, and executive level visibility.
Strong background in package/test co development, product to package integration, test strategy, reliability readiness, and production release.
Familiarity with optical engine, silicon photonics, co packaged optics, AI infrastructure, high speed interconnect, or heterogeneous integration programs is a plus.
Experience partnering with Product Management or Business Development on packaging technology roadmaps or customer commercialization discussions.

As an affirmative employer, all qualified applicants are considered for employment regardless of age, ethnicity, marital status, citizenship, race, religion, political affiliation, gender, sexual orientation and medical and/or physical abilities.

All offers of employment with GlobalFoundries are conditioned upon the successful completion of background checks, medical screenings as applicable and subject to the respective local laws and regulations.

No Recruitment Fee Policy: GlobalFoundries is committed to ethical and transparent hiring practices. Candidates will not be charged any fees at any stage of the recruitment process. Any request for payment related to a GlobalFoundries employment opportunity is unauthorized and should be reported immediately. All legitimate recruitment communications are conducted exclusively through official GlobalFoundries channels. To report concerns or suspected recruitment fraud, please contact our Ethics & Compliance Office at global.compliance@GlobalFoundries.com or visit our official website.

The Ethics & Compliance mailbox is not a recruitment channel. CVs/resumes submitted to this mailbox will not be reviewed, processed, or considered for employment opportunities. Please apply through the official GlobalFoundries careers site only. 

Information about our benefits you can find here: https://gf.com/about-us/careers/opportunities-asia