Asks for

The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Familiar with SPC, 8D, RCA, SYL/SBL.”
The ad says“Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.”
The ad says“15+ year Assembly Engineering experience”
The ad says“Automotive Packaging experience”
The ad says“SMT process, Warpage, and Board Level Reliability testing experience”
The ad says“Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others”
The ad says“Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.”
The ad says“Solid OSAT management experience”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“Familiar with SPC, 8D, RCA, SYL/SBL.”
The ad says“Extensive experience supporting high-volume manufacturing across multiple semiconductor package platforms.”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”
The ad says“SMT process, Warpage, and Board Level Reliability testing experience”
The ad says“Familiar with SPC, 8D, RCA, SYL/SBL.”
The ad says“Familiar with SPC, 8D, RCA, SYL/SBL.”
The ad says“Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.”
The ad says“SMT process, Warpage, and Board Level Reliability testing experience”
The ad says“Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.”

Job Description

Responsibilities:

Lead the global Packaging Sustaining Engineering organization supporting high-volume semiconductor manufacturing across internal assembly sites and OSAT partners throughout Asia, ensuring manufacturing excellence, customer satisfaction, yield, quality, reliability, cost competitiveness, and strategic supplier management.
Responsible for Japan Assembly Engineering (PAE1) and Malysia Assembly Engineering (PAE3) Groups.
Work with Package Development Group (NPI). Takeover qualified products from NPI for mass production.
Work with Supply Chain Management (SCM). Address Capacity or Material supply issues to secure on time delivery.
Work with OSATs and QA to address assembly related quality or customer RMA issues.
Work with Procurement, SCM, and Package Development to define Renesas OSAT strategy.
Do the industry benchmarking on substrate suppliers, material suppliers, equipment suppliers, and competitors. Do the literature survey and perform competitive analysis.
Address PCN and PDN issues.
Publish Weekly Assembly Engineering Statistics. Define action plans for yield improvement, cost reduction, cycle time reduction, and continuous improvement.

Dimensions:

Global responsibility across Asia
Internal factories and multiple OSAT partners
Executive ownership of HVM sustaining.
Global customer support
Lead geographically distributed engineering teams
Own manufacturing excellence, supplier governance, cost reduction, and HVM sustaining

Principal Accountabilities:

Lead Manufacturing Sustaining Engineering for all released production packages.
Own Customer RMA, failure analysis, RCA, CAPA and customer communications.
Drive Yield Improvement and Process Excellence using SPC, DOE, PFMEA and analytics.
Lead Cost Optimization through process, material and manufacturing improvements.
Own Product Change Notification (PCN) planning, qualification and implementation.
Lead Material Review Board (MRB) and disposition of abnormal materials/products.
Manage OSAT suppliers, supplier audits, scorecards and technology alignment

Qualifications

Requirements:

15+ year Assembly Engineering experience
MS or Ph.D. degree, Material Science or Mechanical Engineering
Excellent communication, documentation, and schedule management skills
Excellent leadership, communication and customer management skills.
Solid OSAT management experience
Extensive experience supporting high-volume manufacturing across multiple semiconductor package platforms.
Automotive Packaging experience
Assembly experience on various packages. FCCSP, FCQFN, FCBGA, QFN, QFP, WLCSP, SiP, Module, and 2.5D.
Package substrates experience on MSAP, ETS, Tenting, and ABF substrates.
SMT process, Warpage, and Board Level Reliability testing experience
Familiar with Industry standards. JEDEC, IPC, Automotive quals, and others
Familiar with SPC, 8D, RCA, SYL/SBL.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.