Asks for

The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”
The ad says“In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.”

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world.

What We Offer

Salary:

$161,000.00 - $221,000.00

Location:

Santa Clara,CA

You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go. Learn more about our benefits.

Join the Photonics Platform Business Group at Applied Materials located in Santa Clara headquarters, work with a high caliber cross-functional research team to develop advanced packaging solutions for next-generation smart glasses and high‑performance optical interconnects.

As an Advanced Packaging Integration Engineer, you will lead process integration for high‑performance interconnects and micro-LED panels. You will architect robust, scalable integration flows that meet manufacturability and reliability requirements while driving differentiated technology development. Success in this role requires close collaboration with fabs, assembly houses, suppliers, and cross‑functional teams across Applied Materials and external partners. You will work closely with design, process, integration, and metrology teams to deliver production‑ready solutions.

Key Responsibilities:

Define, develop, execute, and optimize advanced packaging process integration flows (e.g., hybrid bonding, 2.5D/3D heterogeneous integration), to ensure the highest possible product performance, yield, and reliability.

Own, manage, and drive complex technical projects, track progress and solve roadblocks to ensure on time delivery with high quality.

Design experiments, systematically collect and analyze data, drive root-cause analysis and implement corrective actions.

Collaborate with foundries, OSATs, and internal research teams to define and implement improved integration strategies and methodologies.

Stay abreast of the latest field advancements. Apply such knowledge to drive innovations.

Qualifications

Ph.D. or M. S. degree in Materials Science, Electrical Engineering, Chemical Engineering, Applied Physics, or a related STEM field.

In‑depth knowledge and hands‑on experience in advanced packaging technologies, including wafer‑to‑wafer or die‑to‑wafer hybrid bonding, semiconductor processing, 2.5D/3D integration, TSV, RDL, underfill, bumping, molding, and OSAT processes. Candidates with varying experience levels are encouraged to apply. Micro-LED or CPO experience is a plus.

Strong communication and interpersonal skills, with the ability to collaborate effectively across multidisciplinary teams.

Proficient in statistical data analysis and process optimization and control techniques (e.g., Design of Experiments, SPC, JMP). Coding capability is a plus.

Experience with MES systems is a plus.

Ability to prepare clear, compelling executive‑level or customer‑facing presentations is a plus.

Self‑starter with strong problem‑solving skills; able to work both independently and in team environments with minimal supervision.

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes, 10% of the Time

Relocation Eligible:

Yes

The salary offered to a selected candidate will be based on multiple factors including location, hire grade, job-related knowledge, skills, experience, and with consideration of internal equity of our current team members. In addition to a comprehensive benefits package, candidates may be eligible for other forms of compensation such as participation in a bonus and a stock award program, as applicable.

For all sales roles, the posted salary range is the Target Total Cash (TTC) range for the role, which is the sum of base salary and target bonus amount at 100% goal achievement.

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race, color, national origin, citizenship, ancestry, religion, creed, sex, sexual orientation, gender identity, age, disability, veteran or military status, or any other basis prohibited by law.

In addition, Applied endeavors to make our careers site accessible to all users. If you would like to contact us regarding accessibility of our website or need assistance completing the application process, please contact us via e-mail at Accommodations_Program@amat.com, or by calling our HR Direct Help Line at 877-612-7547, option 1, and following the prompts to speak to an HR Advisor. This contact is for accommodation requests only and cannot be used to inquire about the status of applications.

Asks for

Values